Microelectronic Engineering

Microelectronic Engineering is published by Elsevier and is in Zone 3 of Engineering in the CAS Journal Ranking (2025 upgraded edition). By OpenAlex counts of its recent articles, its largest topics are Semiconductor materials and devices, Advancements in Photolithography Techniques and Integrated Circuits and Semiconductor Failure Analysis, together about 34% of its articles. Its main subfields are Electrical and Electronic Engineering. (generated from OpenAlex topic counts and CAS ranking data)

Nanotechnology and Processing — Electronics, photonics, MEMS and Life Sciences Affiliated with iMNEsMicroelectronic Engineering is the premier journal focused on the fabrication and characterization of micro/nano-electronic materials, devices and circuits (including novel electronic nanomaterials), as well as the understanding of their working mechanisms, performance, yield, variability, stability, and reliability. The journal also focuses on the techniques that make possible the fabrication and characterization of such devices and circuits, and on the materials involved in them. Occasionally, outstanding papers on simulation of materials properties, device figures-of-merit or compact modeling of circuits and systems may be accepted. The following topics are of special interest:DevicesPhotonic and optoelectronic devices (including, sensors, actuators, phototransistors)Transistors (including ultra-scaled, thin film, organic, ferroelectric)Resistive switching devices (memristors, RRAM, PCRAM, FeRAM, MRAM)Magnetic and spintronic devicesMEMS and NEMS (including power, RF, magnetic, organic)Flexible electronic devices (including wearable, printed, paper)Devices for energy harvesting (piezoelectric, flexoelectric, photovoltaic, solar cells)Bioelectronic devices (molecular detection, biomimetic, diagnosis)Device-level simulations (including variability and reliability)MaterialsWide bandgap semiconductorsDielectrics (low K and high K)Two-dimensional (2D) Materials and related transferring techniquesNanotubes, nanowires, and other nanomaterials and nanostrctures for device fabricationInterconnects, metallization and barrier materialsNew Resist MaterialsSilicon on insulatorsPolymers and flexible substrates, including biocompatible materialsAtomistic simulations of materials propertiesFabrication and characterization processesThin films deposition techniques (CVD, ALD, evaporation, sputtering, MBE, plasma)Lithography (including optical, EUV, electron beam, nanoimpring, particle-assisted, mask less, X-ray optical methods, emerging methods and limits, as well as resists)Pattern transfer (including ion, plasma and wet transfer, as well as transfer of 2D materials)Integration processes (including inkjet printing, 3D printing, 3D integration)Top-down and bottom-up self-assembly processesAnnealing and its effect in the materials (including crystallization, wrinkling, de-wetting)Nanometrology (TEM, SEM, EDX, EELS, STM, AFM and related setups)Circuits and applicationsSensing and actuation, including bio-compatible applicationsSignal souring and transferLogic operations and data processingElectronic memories and information storageArtificial neural networks and neuromorphic computingCompact modeling of electronic circuitsQuantum computingFive different types of articles are considered:Research articles that report regular original research that produces significant advancement.Accelerated Publications (Letters) that feature exciting research breakthroughs.Review Articles that inform readers of the latest research and advances in a topic within the broad field of microelectronic engineering. This includes roadmaps and guides proposing the recommended methods in a specific field.Short / Technical notes intended for original limited investigations or short description of original industrial or industrially-related research and development workNews and Opinions that comment on topical issues or express views on the developments in related fields, or comment on previously published work

From the journal's Aims & Scope

Research area (LetPub): Engineering, Electrical & Electronic

Editor-in-chief Mario LanzaPublisher website

Editorial board by country: 19 in mainland China (about 31%); most named Mainland China 19, Saudi Arabia 9, India 6, Italy 4, Singapore 4 (62 members with a country) Editorial board ↗Publisher website · 2026-10-01

CAS Journal Ranking

Database indexing

SCIEScopusLetPub

International journal early-warning lists: not listed in any editionLetPub

Indexing the journal's website claims

INISPublisher website

As the journal's website lists them, not checked against each database; for Web of Science editions the records above apply.

Editions, and major and minor categories, are shown separately and never merged into one zone; check which edition your institution uses before you submit or report.

Impact

Impact factor

3.29LetPub · 2026-09-13

Impact factor (publisher)

3.3Publisher website · 2026-10-01

CiteScore 2026-06

7.4LetPub · 2026-09-13

CiteScore (publisher)

7.4Publisher website · 2026-10-01

SJR 2026-06

0.6LetPub · 2026-09-13

SNIP 2026-06

1.08LetPub · 2026-09-13

h-index

89LetPub · 2026-09-13

h-index

123OpenAlex · 2026-10-01

i10-index

5,922OpenAlex · 2026-10-01

2-year mean citedness

3.51OpenAlex · 2026-10-01

Self-citation rate

0%LetPub · 2026-09-13

Share of gold OA articles

19.05%LetPub · 2026-09-13

Volume

Articles per year

85LetPub · 2026-09-13

Sources count differently and were observed at different times, so each source's own value is kept; "publisher" marks figures from the journal's website.

Figures by source

Average review time (community reports)

about 6 monthsLetPub · 2026-09-13

Average acceptance (community reports)

EasyLetPub · 2026-09-13

Submission to first decision

6 daysPublisher website · 2026-10-01

First decision after review

41 daysPublisher website · 2026-10-01

Submission to acceptance

59 daysPublisher website · 2026-10-01

Acceptance to publication

7 daysPublisher website · 2026-10-01

Peer review

Single anonymous peer reviewPublisher website

Community reports come from authors' own submissions (confidence 0.5) and are not a promise from the journal; for publisher figures, the journal's own definitions apply.

A hybrid journal charges the APC only when the author chooses open access; publishing under the subscription model is usually free.

The journal's website is authoritative for fees; sources were observed at different times and each keeps its own value, without averaging.

Excerpts are quoted from the journal's website; "model summary" lines are written by Workers AI and checked against the text. The journal's website is authoritative.

Publisher

Elsevier

Country or region

NETHERLANDS

Language

English

Frequency

Monthly

Founded

1983

ISSN

0167-9317

Electronic ISSN

1873-5568

Official links

• Journal homepage ↗OpenAlex
• Submission system ↗Publisher website
• Special issues ↗Publisher website