Microelectronic Engineering

Microelectronic Engineering 由 Elsevier 出版，属中科院工程技术大类（2025 升级版3区）。按 OpenAlex 近年发文统计，该刊主要发表 Semiconductor materials and devices、Advancements in Photolithography Techniques、Integrated Circuits and Semiconductor Failure Analysis 等主题的论文，这 3 个主题约占 34%，主导子领域为 Electrical and Electronic Engineering。（根据 OpenAlex 主题统计与中科院分区数据生成）

Nanotechnology and Processing — Electronics, photonics, MEMS and Life Sciences Affiliated with iMNEsMicroelectronic Engineering is the premier journal focused on the fabrication and characterization of micro/nano-electronic materials, devices and circuits (including novel electronic nanomaterials), as well as the understanding of their working mechanisms, performance, yield, variability, stability, and reliability. The journal also focuses on the techniques that make possible the fabrication and characterization of such devices and circuits, and on the materials involved in them. Occasionally, outstanding papers on simulation of materials properties, device figures-of-merit or compact modeling of circuits and systems may be accepted. The following topics are of special interest:DevicesPhotonic and optoelectronic devices (including, sensors, actuators, phototransistors)Transistors (including ultra-scaled, thin film, organic, ferroelectric)Resistive switching devices (memristors, RRAM, PCRAM, FeRAM, MRAM)Magnetic and spintronic devicesMEMS and NEMS (including power, RF, magnetic, organic)Flexible electronic devices (including wearable, printed, paper)Devices for energy harvesting (piezoelectric, flexoelectric, photovoltaic, solar cells)Bioelectronic devices (molecular detection, biomimetic, diagnosis)Device-level simulations (including variability and reliability)MaterialsWide bandgap semiconductorsDielectrics (low K and high K)Two-dimensional (2D) Materials and related transferring techniquesNanotubes, nanowires, and other nanomaterials and nanostrctures for device fabricationInterconnects, metallization and barrier materialsNew Resist MaterialsSilicon on insulatorsPolymers and flexible substrates, including biocompatible materialsAtomistic simulations of materials propertiesFabrication and characterization processesThin films deposition techniques (CVD, ALD, evaporation, sputtering, MBE, plasma)Lithography (including optical, EUV, electron beam, nanoimpring, particle-assisted, mask less, X-ray optical methods, emerging methods and limits, as well as resists)Pattern transfer (including ion, plasma and wet transfer, as well as transfer of 2D materials)Integration processes (including inkjet printing, 3D printing, 3D integration)Top-down and bottom-up self-assembly processesAnnealing and its effect in the materials (including crystallization, wrinkling, de-wetting)Nanometrology (TEM, SEM, EDX, EELS, STM, AFM and related setups)Circuits and applicationsSensing and actuation, including bio-compatible applicationsSignal souring and transferLogic operations and data processingElectronic memories and information storageArtificial neural networks and neuromorphic computingCompact modeling of electronic circuitsQuantum computingFive different types of articles are considered:Research articles that report regular original research that produces significant advancement.Accelerated Publications (Letters) that feature exciting research breakthroughs.Review Articles that inform readers of the latest research and advances in a topic within the broad field of microelectronic engineering. This includes roadmaps and guides proposing the recommended methods in a specific field.Short / Technical notes intended for original limited investigations or short description of original industrial or industrially-related research and development workNews and Opinions that comment on topical issues or express views on the developments in related fields, or comment on previously published work

摘自期刊官网 Aims & Scope

研究方向（LetPub）：工程技术-工程：电子与电气

主编 Mario Lanza出版商官网

编委会国家分布：中国大陆 19 位（约 31%）；主要国家 中国 19、沙特阿拉伯 9、印度 6、意大利 4、新加坡 4（共 62 位编委标注了国家） 编委会 ↗出版商官网 · 2026-10-01

中科院期刊分区表

数据库收录

SCIEScopusLetPub

国际期刊预警名单：各版本均未列入LetPub

期刊官网自述收录

INIS出版商官网

期刊官网列出的收录清单，未与各数据库逐一核对；Web of Science 各子库以上方记录为准。

不同版本、大类与小类分别展示，不将不同评价口径合并为一个分区值；投稿与考核前请确认所在机构采用的版本。

影响力指标

影响因子

3.29LetPub · 2026-09-13

影响因子（出版商公布）

3.3出版商官网 · 2026-10-01

CiteScore 2026-06

7.4LetPub · 2026-09-13

CiteScore（出版商公布）

7.4出版商官网 · 2026-10-01

SJR 2026-06

0.6LetPub · 2026-09-13

SNIP 2026-06

1.08LetPub · 2026-09-13

h-index

89LetPub · 2026-09-13

h-index

123OpenAlex · 2026-10-01

i10-index

5,922OpenAlex · 2026-10-01

两年平均被引

3.51OpenAlex · 2026-10-01

自引率

0%LetPub · 2026-09-13

Gold OA 文章占比

19.05%LetPub · 2026-09-13

发文规模

年文章数

85LetPub · 2026-09-13

不同来源的统计口径与观测时间不同，页面保留各来源原值；“出版商公布”为期刊官网自述数据。

各来源数据

平均审稿速度（社区反馈）

平均6.0个月LetPub · 2026-09-13

平均录用比例（社区反馈）

容易LetPub · 2026-09-13

投稿到首次决定

6 天出版商官网 · 2026-10-01

外审后首次决定

41 天出版商官网 · 2026-10-01

投稿到接收

59 天出版商官网 · 2026-10-01

接收到发表

7 天出版商官网 · 2026-10-01

评审方式

单盲同行评审出版商官网

社区反馈来自投稿者样本，置信度 0.5，不代表期刊承诺；“出版商公布”的时间节点定义以官网为准。

混合期刊的文章处理费仅在作者选择开放获取发表时收取；按订阅方式发表通常不收费。

费用以期刊官网为准；不同来源的观测时间可能不同，页面保留各来源原值，不做平均。

摘录来自期刊官网页面，仅保留原文片段；“模型摘要”由 Workers AI 生成并经原文校验，以官网为准。

出版商

Elsevier

出版国家或地区

NETHERLANDS

出版语言

English

出版周期

Monthly

创刊年份

1983

ISSN

0167-9317

电子版 ISSN

1873-5568

官方链接

• 期刊主页 ↗OpenAlex
• 投稿系统 ↗出版商官网
• 专刊 / 特刊征稿 ↗出版商官网