Journal profile · Engineering-Electrical and Electronic Engineering
Journal of Microelectronics and Electronic Packaging
ISSN 1551-4897 · eISSN 1555-8037 · International Microelectronics And Packaging Society
Journal of Microelectronics and Electronic Packaging: fully open access; 11 articles in 2025; indexed in Scopus.
Scope
Aims, scope and focus
Journal of Microelectronics and Electronic Packaging is published by International Microelectronics And Packaging Society. By OpenAlex counts of its recent articles, its largest topics are Electronic Packaging and Soldering Technologies, 3D IC and TSV technologies and Electrical and Thermal Properties of Materials, together about 49.2% of its articles. Its main subfields are Electrical and Electronic Engineering. (generated from OpenAlex topic counts and CAS ranking data)
Research area (LetPub): Engineering-Electrical and Electronic Engineering
Main research topics OpenAlex counts of recent articles; shares are approximate
- Electronic Packaging and Soldering TechnologiesEngineering28.8%
- 3D IC and TSV technologiesEngineering13.6%
- Electrical and Thermal Properties of MaterialsEngineering6.8%
- Advanced MEMS and NEMS TechnologiesEngineering5.5%
- Silicon Carbide Semiconductor TechnologiesEngineering4.6%
- Copper Interconnects and ReliabilityMaterials Science3.9%
- Microwave Dielectric Ceramics SynthesisEngineering3.3%
- Welding Techniques and Residual StressesEngineering3.2%
Rankings & indexing
CAS ranking and database indexing
CAS Journal Ranking
CAS Journal Ranking, upgraded edition (March 2025)Not covered
Not covered by this edition.
CAS Xinrui Journal Ranking (March 2026)Not covered
Not covered by this edition.
CAS Journal Ranking, previous upgraded edition (December 2023)Not covered
Not covered by this edition.
CiteScore quartiles (Scopus, June 2026 release)
| Subject | Quartile | Rank | Percentile |
|---|---|---|---|
| Computer Networks and Communications | Q3 | 335/568 | 41st |
| Electrical and Electronic Engineering | Q3 | 610/1030 | 40th |
| Electronic, Optical and Magnetic Materials | Q3 | 218/318 | 31st |
Scopus ranks journals by CiteScore within each subject: the 75th percentile and above is Q1, then a quartile every 25 points. A different system from the CAS zones.LetPub
Database indexing
ScopusLetPub
International journal early-warning lists: not listed in any editionLetPub
Editions, and major and minor categories, are shown separately and never merged into one zone; check which edition your institution uses before you submit or report.
Metrics
Impact metrics and publication volume
Impact
- CiteScore 2026-06
- 1.9LetPub ·
- SJR 2026-06
- 0.24LetPub ·
- SNIP 2026-06
- 0.49LetPub ·
- h-index
- 23OpenAlex ·
- i10-index
- 83OpenAlex ·
- 2-year mean citedness
- 1.39OpenAlex ·
- Share of gold OA articles
- 0%LetPub ·
Articles by year OpenAlex count · 526 in total · the current year is incomplete
| Year | Articles | Open access | Citations |
|---|---|---|---|
| 2026 | 9 | 9 | 255 |
| 2025 | 11 | 11 | 284 |
| 2024 | 13 | 13 | 229 |
| 2023 | 15 | 15 | 259 |
| 2022 | 19 | 19 | 150 |
| 2021 | 19 | 19 | 146 |
Sources count differently and were observed at different times, so each source's own value is kept; "publisher" marks figures from the journal's website.
Fees & open access
APC and open-access policy
Fully open accessOpenAlex
Every article is open access; authors usually pay an article processing charge (APC).
No source has fee information yet; check the journal's website.
The journal's website is authoritative for fees; sources were observed at different times and each keeps its own value, without averaging.
Profile
Publication details and official links
- Publisher
- International Microelectronics And Packaging Society
- ISSN
- 1551-4897
- Electronic ISSN
- 1555-8037
FAQ
Frequently asked questions about Journal of Microelectronics and Electronic Packaging
Which databases index Journal of Microelectronics and Electronic Packaging?
According to LetPub and DOAJ records, Journal of Microelectronics and Electronic Packaging is indexed in Scopus.
Is Journal of Microelectronics and Electronic Packaging open access, and what is the APC?
Journal of Microelectronics and Electronic Packaging is a fully open-access journal. Fee information is not available yet; check the journal's website.
Sources and updates
The facts on this page come from LetPub, OpenAlex; every figure is tagged with its source and the date it was observed, and conflicting values are kept per source. LetPub source page: view ↗ (archived 2026-08-28). Last updated: .