Journal profile · Engineering, Electrical & Electronic
Journal of Electronic Packaging
ISSN 1043-7398 · eISSN 1528-9044 · American Society of Mechanical Engineers(ASME) · UNITED STATES · Quarterly
Journal of Electronic Packaging: CAS Zone 4 · Engineering (2025 upgraded edition); impact factor 2.12; subscription journal; review over 12 weeks (community reports); community-reported acceptance: easy; 54 articles in 2025; indexed in SCIE and Scopus.
Scope
Aims, scope and focus
Journal of Electronic Packaging is published by American Society of Mechanical Engineers(ASME) and is in Zone 4 of Engineering in the CAS Journal Ranking (2025 upgraded edition). By OpenAlex counts of its recent articles, its largest topics are Electronic Packaging and Soldering Technologies, Heat Transfer and Optimization and 3D IC and TSV technologies, together about 50% of its articles. Its main subfields are Mechanical Engineering and Electrical and Electronic Engineering. (generated from OpenAlex topic counts and CAS ranking data)
The Journal of Electronic Packaging publishes papers that use experimental and theoretical (analytical and computer-aided) methods, approaches, and techniques to address and solve various mechanical, materials, and reliability problems encountered in the analysis, design, manufacturing, testing, and operation of electronic and photonics components, devices, and systems. Scope: Microsystems packaging; Systems integration; Flexible electronics; Materials with nano structures and in general small scale systems.
Source: LetPub
Research area (LetPub): Engineering, Electrical & Electronic
Main research topics OpenAlex counts of recent articles; shares are approximate
- Electronic Packaging and Soldering TechnologiesEngineering24.4%
- Heat Transfer and OptimizationEngineering13.4%
- 3D IC and TSV technologiesEngineering12.3%
- Heat Transfer and Boiling StudiesEngineering6.3%
- Heat Transfer MechanismsEngineering4.7%
- Adhesion, Friction, and Surface InteractionsEngineering3.5%
- Mechanical Behavior of CompositesEngineering3.3%
- Thermal properties of materialsMaterials Science3%
Rankings & indexing
CAS ranking and database indexing
CAS Journal Ranking
CAS Journal Ranking, upgraded edition (March 2025)Engineering Zone 4
| Level | Category | Zone |
|---|---|---|
| Major | Engineering | Zone 4 |
| Minor | Engineering, Electrical & Electronic | Zone 4 |
| Minor | Engineering, Mechanical | Zone 4 |
Top journal: noReview journal: no
CAS Xinrui Journal Ranking (March 2026)Engineering Zone 4
| Level | Category | Zone |
|---|---|---|
| Major | Engineering | Zone 4 |
| Minor | Engineering, Electrical & Electronic | Zone 4 |
| Minor | Engineering, Mechanical | Zone 4 |
Top journal: noReview journal: not marked
CAS Journal Ranking, previous upgraded edition (December 2023)Engineering Zone 4
| Level | Category | Zone |
|---|---|---|
| Major | Engineering | Zone 4 |
| Minor | Engineering, Electrical & Electronic | Zone 4 |
| Minor | Engineering, Mechanical | Zone 4 |
Top journal: noReview journal: no
Database indexing
SCIEScopusLetPub
International journal early-warning lists: not listed in any editionLetPub
Editions, and major and minor categories, are shown separately and never merged into one zone; check which edition your institution uses before you submit or report.
Metrics
Impact metrics and publication volume
Impact
- Impact factor
- 2.12LetPub ·
- CiteScore 2026-06
- 6.6LetPub ·
- SJR 2026-06
- 0.5LetPub ·
- SNIP 2026-06
- 0.97LetPub ·
- h-index
- 46LetPub ·
- h-index
- 81OpenAlex ·
- i10-index
- 1,109OpenAlex ·
- 2-year mean citedness
- 2.5OpenAlex ·
- Self-citation rate
- 4.5%LetPub ·
- Share of gold OA articles
- 2.05%LetPub ·
Volume
- Articles per year
- 43LetPub ·
Articles by year OpenAlex count · 2,305 in total · the current year is incomplete
| Year | Articles | Open access | Citations |
|---|---|---|---|
| 2026 | 49 | 10 | 12 |
| 2025 | 54 | 13 | 110 |
| 2024 | 50 | 3 | 261 |
| 2023 | 42 | 7 | 313 |
| 2022 | 54 | 4 | 404 |
| 2021 | 78 | 11 | 1,116 |
Sources count differently and were observed at different times, so each source's own value is kept; "publisher" marks figures from the journal's website.
Review & acceptance
Review time and acceptance
- Average review time (community reports)
- over 12 weeksLetPub ·
- Average acceptance (community reports)
- EasyLetPub ·
Community reports come from authors' own submissions (confidence 0.5) and are not a promise from the journal; for publisher figures, the journal's own definitions apply.
Fees & open access
APC and open-access policy
Subscription journalLetPub
A subscription journal: articles are read by subscription or purchase, and authors usually pay no publication charge.
No source has fee information yet; check the journal's website.
The journal's website is authoritative for fees; sources were observed at different times and each keeps its own value, without averaging.
Profile
Publication details and official links
- Publisher
- American Society of Mechanical Engineers(ASME)
- Country or region
- UNITED STATES
- Language
- English
- Frequency
- Quarterly
- ISSN
- 1043-7398
- Electronic ISSN
- 1528-9044
- Official links
- Journal homepage ↗OpenAlex
- Submission system ↗LetPub
FAQ
Frequently asked questions about Journal of Electronic Packaging
What CAS zone is Journal of Electronic Packaging in?
In the 2025 upgraded edition of the CAS Journal Ranking, Journal of Electronic Packaging is in Zone 4 of Engineering, and in Zone 4 of the minor category Engineering, Electrical & Electronic / Engineering, Mechanical. In the 2026 Xinrui edition it is in Zone 4 of Engineering. Zones from different editions, and from major and minor categories, are not interchangeable.
What is the impact factor of Journal of Electronic Packaging?
The latest impact factor listed by LetPub is 2.12; CiteScore 6.6, h-index 81.
How long does peer review take at Journal of Electronic Packaging?
Authors report an average review time of over 12 weeks; the community-reported acceptance is “Easy”. Article statistics cover accepted papers only, publisher figures follow the journal's own definitions, and community reports come from authors' own submissions; none is a promise from the journal.
Which databases index Journal of Electronic Packaging?
According to LetPub and DOAJ records, Journal of Electronic Packaging is indexed in SCIE and Scopus.
Is Journal of Electronic Packaging open access, and what is the APC?
Journal of Electronic Packaging is a subscription journal. Fee information is not available yet; check the journal's website.
Sources and updates
The facts on this page come from LetPub, OpenAlex; every figure is tagged with its source and the date it was observed, and conflicting values are kept per source. LetPub source page: view ↗ (archived 2026-08-26). Last updated: .