Journal profile · ENGINEERING, MANUFACTURING-ENGINEERING, ELECTRICAL & ELECTRONIC
IEEE Transactions on Components Packaging and Manufacturing Technology
ISSN 2156-3950 · eISSN 2156-3985 · Institute of Electrical and Electronics Engineers Inc. · UNITED STATES · Founded 2011
IEEE Transactions on Components Packaging and Manufacturing Technology: CAS Zone 3 · Engineering (2025 upgraded edition); impact factor 3.25; subscription journal; APC about USD 2,645; review 3–6 weeks (community reports); community-reported acceptance: easy; 379 articles in 2025; indexed in SCIE and Scopus.
Scope
Aims, scope and focus
IEEE Transactions on Components Packaging and Manufacturing Technology is published by Institute of Electrical and Electronics Engineers Inc. and is in Zone 3 of Engineering in the CAS Journal Ranking (2025 upgraded edition). By OpenAlex counts of its recent articles, its largest topics are Electronic Packaging and Soldering Technologies, 3D IC and TSV technologies and Microwave Engineering and Waveguides, together about 45.1% of its articles. Its main subfields are Electrical and Electronic Engineering. (generated from OpenAlex topic counts and CAS ranking data)
IEEE Transactions on Components, Packaging, and Manufacturing Technology publishes research and application articles on modeling, design, building blocks, technical infrastructure, and analysis underpinning electronic, photonic and MEMS packaging, in addition to new developments in passive components, electrical contacts and connectors, thermal management, and device reliability; as well as the manufacture of electronics parts and assemblies, with broad coverage of design, factory modeling, assembly methods, quality, product robustness, and design-for-environment.
Source: LetPub
Research area (LetPub): ENGINEERING, MANUFACTURING-ENGINEERING, ELECTRICAL & ELECTRONIC
Main research topics OpenAlex counts of recent articles; shares are approximate
- Electronic Packaging and Soldering TechnologiesEngineering20.3%
- 3D IC and TSV technologiesEngineering17%
- Microwave Engineering and WaveguidesEngineering7.9%
- Electromagnetic Compatibility and Noise SuppressionEngineering7.8%
- Advanced Antenna and Metasurface TechnologiesEngineering4.3%
- Silicon Carbide Semiconductor TechnologiesEngineering3.3%
- Heat Transfer and OptimizationEngineering3.2%
- Radio Frequency Integrated Circuit DesignEngineering3.1%
Rankings & indexing
CAS ranking and database indexing
CAS Journal Ranking
CAS Journal Ranking, upgraded edition (March 2025)Engineering Zone 3
| Level | Category | Zone |
|---|---|---|
| Major | Engineering | Zone 3 |
| Minor | Engineering, Electrical & Electronic | Zone 3 |
| Minor | Materials Science, Multidisciplinary | Zone 3 |
| Minor | Engineering, Manufacturing | Zone 4 |
Top journal: noReview journal: no
CAS Xinrui Journal Ranking (March 2026)Engineering Zone 3
| Level | Category | Zone |
|---|---|---|
| Major | Engineering | Zone 3 |
| Minor | Engineering, Manufacturing | Zone 4 |
| Minor | Engineering, Electrical & Electronic | Zone 3 |
| Minor | Materials Science, Multidisciplinary | Zone 3 |
Top journal: noReview journal: not marked
CAS Journal Ranking, previous upgraded edition (December 2023)Engineering Zone 3
| Level | Category | Zone |
|---|---|---|
| Major | Engineering | Zone 3 |
| Minor | Engineering, Electrical & Electronic | Zone 3 |
| Minor | Materials Science, Multidisciplinary | Zone 3 |
| Minor | Engineering, Manufacturing | Zone 4 |
Top journal: noReview journal: no
Database indexing
SCIEScopusLetPub
International journal early-warning lists: not listed in any editionLetPub
Editions, and major and minor categories, are shown separately and never merged into one zone; check which edition your institution uses before you submit or report.
Metrics
Impact metrics and publication volume
Impact
- Impact factor
- 3.25LetPub ·
- CiteScore 2026-06
- 5.9LetPub ·
- SJR 2026-06
- 0.76LetPub ·
- SNIP 2026-06
- 1.51LetPub ·
- h-index
- 39LetPub ·
- h-index
- 80OpenAlex ·
- i10-index
- 1,934OpenAlex ·
- 2-year mean citedness
- 2.88OpenAlex ·
- Self-citation rate
- 12.1%LetPub ·
- Share of gold OA articles
- 3.65%LetPub ·
Volume
- Articles per year
- 296LetPub ·
Articles by year OpenAlex count · 5,257 in total · the current year is incomplete
| Year | Articles | Open access | Citations |
|---|---|---|---|
| 2026 | 299 | 20 | 127 |
| 2025 | 379 | 24 | 995 |
| 2024 | 379 | 53 | 1,918 |
| 2023 | 321 | 106 | 2,948 |
| 2022 | 265 | 101 | 3,158 |
| 2021 | 313 | 104 | 3,983 |
Sources count differently and were observed at different times, so each source's own value is kept; "publisher" marks figures from the journal's website.
Review & acceptance
Review time and acceptance
- Average review time (community reports)
- 3–6 weeksLetPub ·
- Average acceptance (community reports)
- EasyLetPub ·
Community reports come from authors' own submissions (confidence 0.5) and are not a promise from the journal; for publisher figures, the journal's own definitions apply.
Fees & open access
APC and open-access policy
Subscription journalLetPub
A subscription journal: articles are read by subscription or purchase, and authors usually pay no publication charge.
| Source | APC | Fee waiver | License | Observed |
|---|---|---|---|---|
| OpenAlex | USD 2,645 | — | — |
The journal's website is authoritative for fees; sources were observed at different times and each keeps its own value, without averaging.
Profile
Publication details and official links
- Publisher
- Institute of Electrical and Electronics Engineers Inc.
- Country or region
- UNITED STATES
- Language
- English
- Founded
- 2011
- ISSN
- 2156-3950
- Electronic ISSN
- 2156-3985
- Official links
- Journal homepage ↗LetPub
FAQ
Frequently asked questions about IEEE Transactions on Components Packaging and Manufacturing Technology
What CAS zone is IEEE Transactions on Components Packaging and Manufacturing Technology in?
In the 2025 upgraded edition of the CAS Journal Ranking, IEEE Transactions on Components Packaging and Manufacturing Technology is in Zone 3 of Engineering, and in Zone 3 of the minor category Engineering, Electrical & Electronic / Materials Science, Multidisciplinary / Engineering, Manufacturing. In the 2026 Xinrui edition it is in Zone 3 of Engineering. Zones from different editions, and from major and minor categories, are not interchangeable.
What is the impact factor of IEEE Transactions on Components Packaging and Manufacturing Technology?
The latest impact factor listed by LetPub is 3.25; CiteScore 5.9, h-index 80.
How long does peer review take at IEEE Transactions on Components Packaging and Manufacturing Technology?
Authors report an average review time of 3–6 weeks; the community-reported acceptance is “Easy”. Article statistics cover accepted papers only, publisher figures follow the journal's own definitions, and community reports come from authors' own submissions; none is a promise from the journal.
Which databases index IEEE Transactions on Components Packaging and Manufacturing Technology?
According to LetPub and DOAJ records, IEEE Transactions on Components Packaging and Manufacturing Technology is indexed in SCIE and Scopus.
Is IEEE Transactions on Components Packaging and Manufacturing Technology open access, and what is the APC?
IEEE Transactions on Components Packaging and Manufacturing Technology is a subscription journal. APC about USD 2,645.
Sources and updates
The facts on this page come from LetPub, OpenAlex; every figure is tagged with its source and the date it was observed, and conflicting values are kept per source. LetPub source page: view ↗ (archived 2026-08-26). Last updated: .