Journal profile · Materials Science, Multidisciplinary

Microelectronics International

ISSN 1356-5362 · eISSN 1758-812X · Emerald Group Publishing Ltd. · ENGLAND · Tri-annual · Founded 1982

Microelectronics International: CAS Zone 4 · Engineering (2025 upgraded edition); impact factor 1.06; hybrid open access; review over 12 weeks (community reports); community-reported acceptance: easy; 18 articles in 2025; indexed in SCIE and Scopus.

Impact factor1.06Latest value listed by LetPub
CAS zoneZone 4 · Engineering2025 upgraded edition, major category · 2026 Xinrui edition Zone 4 · Engineering
Review timeover 12 weeksCommunity average
APC—No source gives fee information
AcceptanceEasyCommunity average
Articles per year182025 · OpenAlex count

Scope

Aims, scope and focus

Microelectronics International is published by Emerald Group Publishing Ltd. and is in Zone 4 of Engineering in the CAS Journal Ranking (2025 upgraded edition). By OpenAlex counts of its recent articles, its largest topics are 3D IC and TSV technologies, Electronic Packaging and Soldering Technologies and Electrical and Thermal Properties of Materials, together about 32.5% of its articles. Its main subfields are Electrical and Electronic Engineering. (generated from OpenAlex topic counts and CAS ranking data)

Microelectronics International provides an authoritative, international and independent forum for the critical evaluation and dissemination of research and development, applications, processes and current practices relating to advanced packaging, micro-circuit engineering, interconnection, semiconductor technology and systems engineering. It represents a current, comprehensive and practical information tool. The Editor, Dr John Atkinson, welcomes contributions to the journal including technical papers, research papers, case studies and review papers for publication. Please view the Author Guidelines for further details. Microelectronics International comprises a multi-disciplinary study of the key technologies and related issues associated with the design, manufacture, assembly and various applications of miniaturized electronic devices and advanced packages. Among the broad range of topics covered are: • Advanced packaging • Ceramics • Chip attachment • Chip on board (COB) • Chip scale packaging • Flexible substrates • MEMS • Micro-circuit technology • Microelectronic materials • Multichip modules (MCMs) • Organic/polymer electronics • Printed electronics • Semiconductor technology • Solid state sensors • Thermal management • Thick/thin film technology • Wafer scale processing.

Source: LetPub

Research area (LetPub): Materials Science, Multidisciplinary

Main research topics OpenAlex counts of recent articles; shares are approximate

  1. 3D IC and TSV technologiesEngineering13.2%
  2. Electronic Packaging and Soldering TechnologiesEngineering12.4%
  3. Electrical and Thermal Properties of MaterialsEngineering6.9%
  4. Advancements in Semiconductor Devices and Circuit DesignEngineering5.8%
  5. Semiconductor materials and devicesEngineering5.1%
  6. Semiconductor Lasers and Optical DevicesEngineering4.7%
  7. Biotechnology and Related FieldsMedicine3.7%
  8. Electromagnetic Compatibility and Noise SuppressionEngineering3.5%

Rankings & indexing

CAS ranking and database indexing

CAS Journal Ranking

CAS Journal Ranking, upgraded edition (March 2025)Engineering Zone 4
LevelCategoryZone
MajorEngineeringZone 4
MinorEngineering, Electrical & ElectronicZone 4
MinorMaterials Science, MultidisciplinaryZone 4

Top journal: noReview journal: no

CAS Xinrui Journal Ranking (March 2026)Engineering Zone 4
LevelCategoryZone
MajorEngineeringZone 4
MinorEngineering, Electrical & ElectronicZone 4
MinorMaterials Science, MultidisciplinaryZone 4

Top journal: noReview journal: not marked

CAS Journal Ranking, previous upgraded edition (December 2023)Engineering Zone 4
LevelCategoryZone
MajorEngineeringZone 4
MinorEngineering, Electrical & ElectronicZone 4
MinorMaterials Science, MultidisciplinaryZone 4

Top journal: noReview journal: no

Database indexing

SCIEScopusLetPub

International journal early-warning lists: not listed in any editionLetPub

Editions, and major and minor categories, are shown separately and never merged into one zone; check which edition your institution uses before you submit or report.

Metrics

Impact metrics and publication volume

Impact

Impact factor
1.06LetPub ·
CiteScore 2026-06
2.6LetPub ·
SJR 2026-06
0.22LetPub ·
SNIP 2026-06
0.53LetPub ·
h-index
19LetPub ·
h-index
32OpenAlex ·
i10-index
168OpenAlex ·
2-year mean citedness
0.33OpenAlex ·
Self-citation rate
0%LetPub ·
Share of gold OA articles
0%LetPub ·

Volume

Articles per year
13LetPub ·

Articles by year OpenAlex count · 1,993 in total · the current year is incomplete

YearArticlesOpen accessCitations
20264214
20251819
2024619
2023333119
2022321134
2021302104

Sources count differently and were observed at different times, so each source's own value is kept; "publisher" marks figures from the journal's website.

Review & acceptance

Review time and acceptance

Average review time (community reports)
over 12 weeksLetPub ·
Average acceptance (community reports)
EasyLetPub ·

Community reports come from authors' own submissions (confidence 0.5) and are not a promise from the journal; for publisher figures, the journal's own definitions apply.

Fees & open access

APC and open-access policy

Hybrid open accessLetPub

A subscription journal in which authors can pay to publish their article open access.

No source has fee information yet; check the journal's website.

A hybrid journal charges the APC only when the author chooses open access; publishing under the subscription model is usually free.

The journal's website is authoritative for fees; sources were observed at different times and each keeps its own value, without averaging.

Profile

Publication details and official links

Publisher
Emerald Group Publishing Ltd.
Country or region
ENGLAND
Language
English
Frequency
Tri-annual
Founded
1982
ISSN
1356-5362
Electronic ISSN
1758-812X
Official links

FAQ

Frequently asked questions about Microelectronics International

What CAS zone is Microelectronics International in?

In the 2025 upgraded edition of the CAS Journal Ranking, Microelectronics International is in Zone 4 of Engineering, and in Zone 4 of the minor category Engineering, Electrical & Electronic / Materials Science, Multidisciplinary. In the 2026 Xinrui edition it is in Zone 4 of Engineering. Zones from different editions, and from major and minor categories, are not interchangeable.

What is the impact factor of Microelectronics International?

The latest impact factor listed by LetPub is 1.06; CiteScore 2.6, h-index 32.

How long does peer review take at Microelectronics International?

Authors report an average review time of over 12 weeks; the community-reported acceptance is “Easy”. Article statistics cover accepted papers only, publisher figures follow the journal's own definitions, and community reports come from authors' own submissions; none is a promise from the journal.

Which databases index Microelectronics International?

According to LetPub and DOAJ records, Microelectronics International is indexed in SCIE and Scopus.

Is Microelectronics International open access, and what is the APC?

Microelectronics International is a hybrid journal. Fee information is not available yet; check the journal's website.

Sources and updates

The facts on this page come from LetPub, OpenAlex; every figure is tagged with its source and the date it was observed, and conflicting values are kept per source. LetPub source page: view ↗ (archived 2026-08-26). Last updated: .