Journal profile · Materials Science, Multidisciplinary
IEEE Transactions on Components and Packaging Technologies
ISSN 1521-3331 · UNITED STATES · Quarterly
IEEE Transactions on Components and Packaging Technologies: subscription journal; community-reported acceptance: easy; 0 articles in 2025; the journal's website says it has ceased publication.
The journal's website says it has ceased publication: This title ceased publication in 2010. The current retitled publication is IEEE Transactions on Components, Packaging and Manufacturing Technology. Source ↗Publisher website ·
Scope
Aims, scope and focus
By OpenAlex counts of its recent articles, IEEE Transactions on Components and Packaging Technologies's largest topics are Electronic Packaging and Soldering Technologies, 3D IC and TSV technologies and Heat Transfer and Optimization, together about 43% of its articles. Its main subfields are Electrical and Electronic Engineering and Mechanical Engineering. (generated from OpenAlex topic counts and CAS ranking data)
IEEE Transactions on Components and Packaging Technologies publishes research and applications articles on the modeling, building blocks, technical infrastructure, and analysis underpinning electronic, photonic, MEMS and sensor packaging; new developments in passive and integrated components, electrical contacts and connectors, bonding,interconnection, device reliability and failure modes, and materials for electronics; thermal management, including thermomechanics, thermal measurement, cooling technology, and thermal phenomena in electronics.
From the journal's Aims & Scope
Research area (LetPub): Materials Science, Multidisciplinary
Main research topics OpenAlex counts of recent articles; shares are approximate
- Electronic Packaging and Soldering TechnologiesEngineering24%
- 3D IC and TSV technologiesEngineering9.8%
- Heat Transfer and OptimizationEngineering9.2%
- Heat Transfer and Numerical MethodsEngineering7.3%
- Electrical Contact Performance and AnalysisEngineering5.6%
- Heat Transfer and Boiling StudiesEngineering3.7%
- Silicon Carbide Semiconductor TechnologiesEngineering3.6%
- Integrated Circuits and Semiconductor Failure AnalysisEngineering3.4%
Rankings & indexing
CAS ranking and database indexing
CAS Journal Ranking
CAS Journal Ranking, upgraded edition (March 2025)Not covered
Not covered by this edition.
CAS Xinrui Journal Ranking (March 2026)Not covered
Not covered by this edition.
CAS Journal Ranking, previous upgraded edition (December 2023)Not covered
Not covered by this edition.
Database indexing
Indexed in: no record yet.
International journal early-warning lists: not listed in any editionLetPub
Editions, and major and minor categories, are shown separately and never merged into one zone; check which edition your institution uses before you submit or report.
Metrics
Impact metrics and publication volume
Impact
- h-index
- 89OpenAlex ·
- i10-index
- 864OpenAlex ·
- 2-year mean citedness
- 0OpenAlex ·
- Share of gold OA articles
- 0%LetPub ·
Articles by year OpenAlex count · 1,507 in total · the current year is incomplete
| Year | Articles | Open access | Citations |
|---|---|---|---|
| 2026 | 0 | 0 | 1,054 |
| 2025 | 0 | 0 | 1,346 |
| 2024 | 0 | 0 | 1,497 |
| 2023 | 1 | 0 | 1,481 |
| 2022 | 0 | 0 | 1,578 |
| 2021 | 0 | 0 | 1,680 |
Sources count differently and were observed at different times, so each source's own value is kept; "publisher" marks figures from the journal's website.
Review & acceptance
Review time and acceptance
- Average acceptance (community reports)
- EasyLetPub ·
Community reports come from authors' own submissions (confidence 0.5) and are not a promise from the journal; for publisher figures, the journal's own definitions apply.
Fees & open access
APC and open-access policy
Subscription journalLetPub
A subscription journal: articles are read by subscription or purchase, and authors usually pay no publication charge.
No source has fee information yet; check the journal's website.
The journal's website is authoritative for fees; sources were observed at different times and each keeps its own value, without averaging.
Profile
Publication details and official links
- Country or region
- UNITED STATES
- Frequency
- Quarterly
- ISSN
- 1521-3331
- Official links
- Journal homepage ↗LetPub
- Submission system ↗LetPub
FAQ
Frequently asked questions about IEEE Transactions on Components and Packaging Technologies
Is IEEE Transactions on Components and Packaging Technologies open access, and what is the APC?
IEEE Transactions on Components and Packaging Technologies is a subscription journal. Fee information is not available yet; check the journal's website.
Sources and updates
The facts on this page come from LetPub, OpenAlex, Publisher website; every figure is tagged with its source and the date it was observed, and conflicting values are kept per source. LetPub source page: view ↗ (archived 2026-08-24). Last updated: .