Sensors and Actuators A Physical

Sensors and Actuators A Physical 由 Elsevier 出版，属中科院工程技术大类（2025 升级版3区）。按 OpenAlex 近年发文统计，该刊主要发表 Advanced MEMS and NEMS Technologies、Advanced Sensor and Energy Harvesting Materials、Mechanical and Optical Resonators 等主题的论文，这 3 个主题约占 32.1%，主导子领域为 Electrical and Electronic Engineering、Biomedical Engineering。（根据 OpenAlex 主题统计与中科院分区数据生成）

An international journal devoted to research and development of physical transducersSensors and Actuators A: Physical brings together multidisciplinary interests in one journal entirely devoted to disseminating information on all aspects of research and development of solid-state devices for transducing physical signals. Sensors and Actuators A: Physical regularly publishes original papers, letters to the Editors and from time to time invited review articles within the following device areas:• Fundamentals and Physics, such as: classification of effects, physical effects, measurement theory, modelling of sensors, measurement standards, measurement errors, units and constants, time and frequency measurement. Modeling papers should bring new modeling techniques to the field and be supported by experimental results.• Materials and their Processing, such as: piezoelectric materials, polymers, metal oxides, III-V and II-VI semiconductors, thick and thin films, optical glass fibres, amorphous, polycrystalline and monocrystalline silicon.• Optoelectronic sensors, such as: photovoltaic diodes, photoconductors, photodiodes, phototransistors, positron-sensitive photodetectors, optoisolators, photodiode arrays, charge-coupled devices, light-emitting diodes, injection lasers and liquid-crystal displays.• Mechanical sensors, such as: metallic, thin-film and semiconductor strain gauges, diffused silicon pressure sensors, silicon accelerometers, solid-state displacement transducers, piezo junction devices, piezoelectric field-effect transducers (PiFETs), tunnel-diode strain sensors, surface acoustic wave devices, silicon micromechanical switches, solid-state flow meters and electronic flow controllers.• Thermal sensors, such as: platinum resistors, thermistors, diode temperature sensors, silicon transistor thermometers, integrated temperature transducers, PTAT circuits, thermocouples, thermopiles, pyroelectric thermometers, quartz thermometers, power transistors and thick-film thermal print heads.• Magnetic sensors, such as: magnetoresistors, Corbino disks, magnetodiodes, Hall-effect devices, integrated Hall devices, silicon depletion-layer magnetometers, magneto-injection transistors, magnistors, lateral magnetotransistors, carrier-domain magnetometers, MOS magnetic-field sensors, solid-state read and write heads.• Micromechanics, such as: research papers on actuators, structures, integrated sensors-actuators, microsystems, and other devices or subdevices ranging in size from millimetres to sub-microns; micromechatronics; microelectromechanical systems; microoptomechanical systems; microchemomechanical systems; microrobots; silicon and non-silicon fabrication techniques; basic studies of physical phenomena of interest to micromechanics; analysis of microsystems; exploration of new topics and materials related to micromechanics; microsystem-related problems like power supplies and signal transmission, microsystem-related simulation tools; other topics of interest to micromechanics.• Interface electronics: electronic circuits which are designed to interface directly with the above transducers and which are used for improving or complementing the characteristics of these devices, such as linearization, A/D conversion, temperature compensation, light-intensity compensation, current/frequency conversion and microcomputer interfacing.• Sensor Systems and Applications, such as: sensor buses, multiple-sensor systems, sensor networks, voting systems, telemetering, sensor arrays, and automotive, environmental, monitoring and control, consumer, medical, alarm and security, robotic, nautical, aeronautical and space measurement systems.

摘自期刊官网 Aims & Scope

研究方向（LetPub）：工程技术-工程：电子与电气

主编 Liang Dong出版商官网

编委会国家分布：中国大陆 13 位（约 22%）；主要国家 美国 17、中国 13、日本 10、荷兰 4、德国 3（共 58 位编委标注了国家） 编委会 ↗出版商官网 · 2026-10-01

中科院期刊分区表

数据库收录

SCIEScopusLetPub

国际期刊预警名单：各版本均未列入LetPub

不同版本、大类与小类分别展示，不将不同评价口径合并为一个分区值；投稿与考核前请确认所在机构采用的版本。

影响力指标

影响因子

5.08LetPub · 2026-09-13

影响因子（出版商公布）

5.1出版商官网 · 2026-10-01

CiteScore 2026-06

8.2LetPub · 2026-09-13

CiteScore（出版商公布）

8.2出版商官网 · 2026-10-01

SJR 2026-06

0.8LetPub · 2026-09-13

SNIP 2026-06

1.2LetPub · 2026-09-13

h-index

139LetPub · 2026-09-13

h-index

207OpenAlex · 2026-10-01

i10-index

11,362OpenAlex · 2026-10-01

两年平均被引

5.2OpenAlex · 2026-10-01

自引率

7.8%LetPub · 2026-09-13

Gold OA 文章占比

12.85%LetPub · 2026-09-13

发文规模

年文章数

1,096LetPub · 2026-09-13

不同来源的统计口径与观测时间不同，页面保留各来源原值；“出版商公布”为期刊官网自述数据。

各来源数据

平均审稿速度（社区反馈）

平均3.0个月来源Elsevier官网：平均11.4周LetPub · 2026-09-13

平均录用比例（社区反馈）

容易LetPub · 2026-09-13

投稿到首次决定

13 天出版商官网 · 2026-10-01

外审后首次决定

43 天出版商官网 · 2026-10-01

投稿到接收

91 天出版商官网 · 2026-10-01

接收到发表

3 天出版商官网 · 2026-10-01

评审方式

单盲同行评审出版商官网

社区反馈来自投稿者样本，置信度 0.5，不代表期刊承诺；“出版商公布”的时间节点定义以官网为准。

混合期刊的文章处理费仅在作者选择开放获取发表时收取；按订阅方式发表通常不收费。

费用以期刊官网为准；不同来源的观测时间可能不同，页面保留各来源原值，不做平均。

摘录来自期刊官网页面，仅保留原文片段；“模型摘要”由 Workers AI 生成并经原文校验，以官网为准。

出版商

Elsevier

出版国家或地区

SWITZERLAND

出版语言

English

出版周期

Monthly

创刊年份

1990

ISSN

0924-4247

电子版 ISSN

1873-3069

官方链接

• 期刊主页 ↗OpenAlex
• 投稿系统 ↗LetPub
• 作者指南 ↗LetPub
• 专刊 / 特刊征稿 ↗出版商官网