期刊档案
MATERIALS SCIENCE IN SEMICONDUCTOR PROCESSING
— · ISSN 1369-8001 · 工程技术-材料科学:综合
数据可追溯 · letpub-v6 · 更新于 2026-08-24期刊简介
研究范围与定位
Materials Science in Semiconductor Processing provides a unique forum for the discussion of novel processing, applications and theoretical studies of functional materials and devices for (opto)electronics, sensors, detectors, biotechnology and green energy.Each issue will aim to provide a snapshot of current insights, new achievements, breakthroughs and future trends in such diverse fields as microelectronics, energy conversion and storage, communications, biotechnology, (photo)catalysis, nano- and thin-film technology, hybrid and composite materials, chemical processing, vapor-phase deposition, device fabrication, and modelling, which are the backbone of advanced semiconductor processing and applications.Coverage will include: advanced lithography for submicron devices; etching and related topics; ion implantation; damage evolution and related issues; plasma and thermal CVD; rapid thermal processing; advanced metallization and interconnect schemes; thin dielectric layers, oxidation; sol-gel processing; chemical bath and (electro)chemical deposition; compound semiconductor processing; new non-oxide materials and their applications; (macro)molecular and hybrid materials; molecular dynamics, ab-initio methods, Monte Carlo, etc.; new materials and processes for discrete and integrated circuits; magnetic materials and spintronics; heterostructures and quantum devices; engineering of the electrical and optical properties of semiconductors; crystal growth mechanisms; reliability, defect density, intrinsic impurities and defects.
结构化分区
学科分区明细
不同版本、大类与小类分别展示,不将不同评价口径合并为一个分区值。
《新锐期刊分区表》( 2026年3月发布)
2026-03 · 5 个学科记录
| 类别 | 学科 | 分区 |
|---|---|---|
| 大类 | 材料科学 | 3区 |
| 小类 | 工程:电子与电气ENGINEERING, ELECTRICAL & ELECTRONIC | 3区 |
| 小类 | 材料科学:综合MATERIALS SCIENCE, MULTIDISCIPLINARY | 3区 |
| 小类 | 物理:应用PHYSICS, APPLIED | 3区 |
| 小类 | 物理:凝聚态物理PHYSICS, CONDENSED MATTER | 3区 |
期刊分区表( 2025年3月升级版)
2025-03 · 5 个学科记录
| 类别 | 学科 | 分区 |
|---|---|---|
| 大类 | 材料科学 | 3区 |
| 小类 | 物理:凝聚态物理PHYSICS, CONDENSED MATTER | 2区 |
| 小类 | 工程:电子与电气ENGINEERING, ELECTRICAL & ELECTRONIC | 3区 |
| 小类 | 材料科学:综合MATERIALS SCIENCE, MULTIDISCIPLINARY | 3区 |
| 小类 | 物理:应用PHYSICS, APPLIED | 3区 |
期刊分区表( 2023年12月旧的升级版)
2023-12 · 5 个学科记录
| 类别 | 学科 | 分区 |
|---|---|---|
| 大类 | 工程技术 | 3区 |
| 小类 | 工程:电子与电气ENGINEERING, ELECTRICAL & ELECTRONIC | 3区 |
| 小类 | 材料科学:综合MATERIALS SCIENCE, MULTIDISCIPLINARY | 3区 |
| 小类 | 物理:应用PHYSICS, APPLIED | 3区 |
| 小类 | 物理:凝聚态物理PHYSICS, CONDENSED MATTER | 3区 |
期刊档案
出版与身份
- 期刊ISSN
- 1369-8001
- 是否OA开放访问
- No
- 通讯方式
- ELSEVIER SCI LTD, THE BOULEVARD, LANGFORD LANE, KIDLINGTON, OXFORD, ENGLAND, OXON, OX5 1GB
- 出版商
- Elsevier Ltd
- 出版国家或地区
- ENGLAND
- 出版语言
- English
- 出版周期
- Bimonthly
- 出版年份
- 0
- 在线出版周期
- 来源Elsevier官网:平均4.1周
期刊档案
研究范围
- 期刊简介
- Materials Science in Semiconductor Processing provides a unique forum for the discussion of novel processing, applications and theoretical studies of functional materials and devices for (opto)electronics, sensors, detectors, biotechnology and green energy.Each issue will aim to provide a snapshot of current insights, new achievements, breakthroughs and future trends in such diverse fields as microelectronics, energy conversion and storage, communications, biotechnology, (photo)catalysis, nano- and thin-film technology, hybrid and composite materials, chemical processing, vapor-phase deposition, device fabrication, and modelling, which are the backbone of advanced semiconductor processing and applications.Coverage will include: advanced lithography for submicron devices; etching and related topics; ion implantation; damage evolution and related issues; plasma and thermal CVD; rapid thermal processing; advanced metallization and interconnect schemes; thin dielectric layers, oxidation; sol-gel processing; chemical bath and (electro)chemical deposition; compound semiconductor processing; new non-oxide materials and their applications; (macro)molecular and hybrid materials; molecular dynamics, ab-initio methods, Monte Carlo, etc.; new materials and processes for discrete and integrated circuits; magnetic materials and spintronics; heterostructures and quantum devices; engineering of the electrical and optical properties of semiconductors; crystal growth mechanisms; reliability, defect density, intrinsic impurities and defects.
- 涉及的研究方向
- 工程技术-材料科学:综合
期刊档案
指标与活跃度
- 2025-2026最新IF(数据来源于网友提供)
- 注册或登录后,查看IF
- 实时影响因子
- 截止2026年5月06日:5.23
- 2025-2026自引率
- 3.8%点击查看自引率趋势图
- 五年IF(数据来源于网友提供)
- 4.602数据由网友[fasteagle510]收集提供
- h-index
- 49
- CiteScore ( 2026年6月最新版)
- CiteScoreSJRSNIPCiteScore排名8.700.7671.069学科分区排名百分位大类:Engineering小类:Mechanical EngineeringQ193 / 740 87% 大类:Engineering小类:Condensed Matter PhysicsQ157 / 446 87% 大类:Engineering小类:Mechanics of MaterialsQ162 / 408 84% 大类:Engineering小类:General Materials ScienceQ1103 / 475 78%
- 年文章数
- 967点击查看年文章数趋势图
- Gold OA文章占比
- 10.45%
- 研究类文章占比:文章 ÷(文章 + 综述)
- 94.73%
期刊档案
分区、收录与风险
- WOS期刊JCR分区 ( 2025-2026年最新版)
- 注册或登录后,查看WOS分区等级
- 期刊分区表预警名单
- 2026年03月发布的新锐学术版:不在预警名单中2025年03月发布的2025版:不在预警名单中2024年02月发布的2024版:不在预警名单中2023年01月发布的2023版:不在预警名单中2021年12月发布的2021版:不在预警名单中2020年12月发布的2020版:不在预警名单中
- SCI期刊收录coverage
- Science Citation Index Expanded (SCIE) (2020年1月,原SCI撤销合并入SCIE,统称SCIE)Scopus (CiteScore)
- PubMed Central (PMC)链接
- 访问官方页面 ↗
期刊档案
投稿与评审
- 期刊官方网站
- https://www.journals.elsevier.com/materials-science-in-semiconductor-processing 投稿规范预检(避免 Desk Rejection) 开始检查>>
- 期刊投稿网址
- https://www.editorialmanager.com/MSSP AI辅助快速完成投稿信初稿 一键撰写投稿信>>
- 平均审稿速度
- 网友分享经验:平均1.7个月来源Elsevier官网:平均3.7周
- 平均录用比例
- 网友分享经验:约88.33%来源Elsevier官网:15%
来源与统计口径
来源:LetPub 原始详情页 ↗。投稿经验仅展示聚合统计,不公开第三方正文或用户标识。当前聚合样本:暂无。