期刊档案

MATERIALS SCIENCE IN SEMICONDUCTOR PROCESSING

— · ISSN 1369-8001 · 工程技术-材料科学:综合

数据可追溯 · letpub-v6 · 更新于 2026-08-24
影响指标5.23
h-index49
平均审稿速度网友分享经验:平均1.7个月来源Elsevier官网:平均3.7周
平均录用比例网友分享经验:约88.33%来源Elsevier官网:15%

期刊简介

研究范围与定位

Materials Science in Semiconductor Processing provides a unique forum for the discussion of novel processing, applications and theoretical studies of functional materials and devices for (opto)electronics, sensors, detectors, biotechnology and green energy.Each issue will aim to provide a snapshot of current insights, new achievements, breakthroughs and future trends in such diverse fields as microelectronics, energy conversion and storage, communications, biotechnology, (photo)catalysis, nano- and thin-film technology, hybrid and composite materials, chemical processing, vapor-phase deposition, device fabrication, and modelling, which are the backbone of advanced semiconductor processing and applications.Coverage will include: advanced lithography for submicron devices; etching and related topics; ion implantation; damage evolution and related issues; plasma and thermal CVD; rapid thermal processing; advanced metallization and interconnect schemes; thin dielectric layers, oxidation; sol-gel processing; chemical bath and (electro)chemical deposition; compound semiconductor processing; new non-oxide materials and their applications; (macro)molecular and hybrid materials; molecular dynamics, ab-initio methods, Monte Carlo, etc.; new materials and processes for discrete and integrated circuits; magnetic materials and spintronics; heterostructures and quantum devices; engineering of the electrical and optical properties of semiconductors; crystal growth mechanisms; reliability, defect density, intrinsic impurities and defects.

结构化分区

学科分区明细

不同版本、大类与小类分别展示,不将不同评价口径合并为一个分区值。

《新锐期刊分区表》( 2026年3月发布)

2026-03 · 5 个学科记录

Top:否综述:N/A
类别学科分区
大类材料科学3区
小类工程:电子与电气ENGINEERING, ELECTRICAL & ELECTRONIC3区
小类材料科学:综合MATERIALS SCIENCE, MULTIDISCIPLINARY3区
小类物理:应用PHYSICS, APPLIED3区
小类物理:凝聚态物理PHYSICS, CONDENSED MATTER3区

期刊分区表( 2025年3月升级版)

2025-03 · 5 个学科记录

Top:否综述:否
类别学科分区
大类材料科学3区
小类物理:凝聚态物理PHYSICS, CONDENSED MATTER2区
小类工程:电子与电气ENGINEERING, ELECTRICAL & ELECTRONIC3区
小类材料科学:综合MATERIALS SCIENCE, MULTIDISCIPLINARY3区
小类物理:应用PHYSICS, APPLIED3区

期刊分区表( 2023年12月旧的升级版)

2023-12 · 5 个学科记录

Top:否综述:否
类别学科分区
大类工程技术3区
小类工程:电子与电气ENGINEERING, ELECTRICAL & ELECTRONIC3区
小类材料科学:综合MATERIALS SCIENCE, MULTIDISCIPLINARY3区
小类物理:应用PHYSICS, APPLIED3区
小类物理:凝聚态物理PHYSICS, CONDENSED MATTER3区

期刊档案

出版与身份

期刊ISSN
1369-8001
是否OA开放访问
No
通讯方式
ELSEVIER SCI LTD, THE BOULEVARD, LANGFORD LANE, KIDLINGTON, OXFORD, ENGLAND, OXON, OX5 1GB
出版商
Elsevier Ltd
出版国家或地区
ENGLAND
出版语言
English
出版周期
Bimonthly
出版年份
0
在线出版周期
来源Elsevier官网:平均4.1周

期刊档案

研究范围

期刊简介
Materials Science in Semiconductor Processing provides a unique forum for the discussion of novel processing, applications and theoretical studies of functional materials and devices for (opto)electronics, sensors, detectors, biotechnology and green energy.Each issue will aim to provide a snapshot of current insights, new achievements, breakthroughs and future trends in such diverse fields as microelectronics, energy conversion and storage, communications, biotechnology, (photo)catalysis, nano- and thin-film technology, hybrid and composite materials, chemical processing, vapor-phase deposition, device fabrication, and modelling, which are the backbone of advanced semiconductor processing and applications.Coverage will include: advanced lithography for submicron devices; etching and related topics; ion implantation; damage evolution and related issues; plasma and thermal CVD; rapid thermal processing; advanced metallization and interconnect schemes; thin dielectric layers, oxidation; sol-gel processing; chemical bath and (electro)chemical deposition; compound semiconductor processing; new non-oxide materials and their applications; (macro)molecular and hybrid materials; molecular dynamics, ab-initio methods, Monte Carlo, etc.; new materials and processes for discrete and integrated circuits; magnetic materials and spintronics; heterostructures and quantum devices; engineering of the electrical and optical properties of semiconductors; crystal growth mechanisms; reliability, defect density, intrinsic impurities and defects.
涉及的研究方向
工程技术-材料科学:综合

期刊档案

指标与活跃度

2025-2026最新IF(数据来源于网友提供)
注册或登录后,查看IF
实时影响因子
截止2026年5月06日:5.23
2025-2026自引率
3.8%点击查看自引率趋势图
五年IF(数据来源于网友提供)
4.602数据由网友[fasteagle510]收集提供
h-index
49
CiteScore ( 2026年6月最新版)
CiteScoreSJRSNIPCiteScore排名8.700.7671.069学科分区排名百分位大类:Engineering小类:Mechanical EngineeringQ193 / 740 87% 大类:Engineering小类:Condensed Matter PhysicsQ157 / 446 87% 大类:Engineering小类:Mechanics of MaterialsQ162 / 408 84% 大类:Engineering小类:General Materials ScienceQ1103 / 475 78%
年文章数
967点击查看年文章数趋势图
Gold OA文章占比
10.45%
研究类文章占比:文章 ÷(文章 + 综述)
94.73%

期刊档案

分区、收录与风险

WOS期刊JCR分区 ( 2025-2026年最新版)
注册或登录后,查看WOS分区等级
期刊分区表预警名单
2026年03月发布的新锐学术版:不在预警名单中2025年03月发布的2025版:不在预警名单中2024年02月发布的2024版:不在预警名单中2023年01月发布的2023版:不在预警名单中2021年12月发布的2021版:不在预警名单中2020年12月发布的2020版:不在预警名单中
SCI期刊收录coverage
Science Citation Index Expanded (SCIE) (2020年1月,原SCI撤销合并入SCIE,统称SCIE)Scopus (CiteScore)
PubMed Central (PMC)链接
访问官方页面 ↗

期刊档案

投稿与评审

期刊官方网站
https://www.journals.elsevier.com/materials-science-in-semiconductor-processing 投稿规范预检(避免 Desk Rejection) 开始检查>>
期刊投稿网址
https://www.editorialmanager.com/MSSP AI辅助快速完成投稿信初稿 一键撰写投稿信>>
平均审稿速度
网友分享经验:平均1.7个月来源Elsevier官网:平均3.7周
平均录用比例
网友分享经验:约88.33%来源Elsevier官网:15%

来源与统计口径

来源:LetPub 原始详情页 ↗。投稿经验仅展示聚合统计,不公开第三方正文或用户标识。当前聚合样本:暂无。